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When the user equipment communicates with the AP1, because the equipment receives the interference signal of the AP2 with the same frequency, the user equipment will mistakenly think that the cell of the AP1 is being occupied by other devices in the cell at this time, so wait for the next time period to send. As a result, network performance is degraded. Not only multi-cell networking, this kind of interference problem will also occur when the Wi-Fi AP is very close. For example, although you have only one wireless AP in your home, if your next-door neighbor has an AP deployed on the same channel as you, CCI will also reduce the success rate of your device access. Sadly, most manufacturers put Wi-Fi AP’s default channel on the first channel when the device leaves the factory. In this way, the problem of interference is even more serious. If you find this problem, you might as well change the Wi-Fi AP channel at home, which will significantly reduce interference and increase Internet speed. The solution of Wi-Fi 6 is to distinguish the local cell from the interference cell by introducing BSS Coloring (Cell Color coding) technology into the MAC layer. In other words, when working on the same channel, the AP that interferes with each other will be distinguished by different color codes.
From April 2020 to June 2020, the demand for cars dropped sharply due to the spread of the COVID-19 epidemic. Automakers purchase parts according to Toyota’s “Just In Time” mode of operation, so, for example, Toyota canceled orders for in-car semiconductors for Denso, its main subcontractor, which canceled orders for in-car semiconductors such as Renesas, which then cancelled subsequent orders for 28nm, which was commissioned by TSMC. Due to the special needs of COVID-19 at home under the epidemic, the production of 28nm semiconductors such as TSMC game consoles and household appliances swarmed in, and the blank production line after the cancellation of car semiconductors was instantly filled with these semiconductors.
Key Technologies of SoC Design: SoC key technologies mainly include bus architecture technology, IP core reuse technology, software and hardware co-design technology, SoC verification technology, testability design technology, low-power design technology, ultra-deep sub-micron circuit implementation technology, and embedded software porting. A circuit system capable of realizing certain functions is composed of multiple modules, such as processors, interfaces, memories, analog-to-digital converters, and so on. These functional modules can be implemented by discrete devices, and then combined on a printed circuit board (PCB) to finally form a system-on-a-Board. A schematic diagram of the on-board system is shown below.
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